26 Mar

4DSP’s New FPGA-based Products Benefit from Xilinx UltraScale

4DSP is using the newest and most powerful gKintex UltraScale detaileneration of Xilinx FPGAs in its most recent products. The basic logic cell structure of these UltraScale devices remains essentially unchanged and the available resources on the chip are largely what you would expect – LUTs, Memory, DSP blocks, standard IOs, and SerDes transceivers. Xilinx has, however, fine-tuned these resources specifically for the increasingly demanding applications that designers face. As a close partner of Xilinx, 4DSP immediately began developing products to take advantage of the performance gains offered by these new devices and we introduced our first UltraScale-based product in December. 4DSP now offers Kintex UltraScale FPGAs on our three newest PCIe boards.

PC820 – carrier card with 1x FMC (VITA 57.1) site

PC821 – carrier card with 2x FMC (VITA 57.1) sites

PC870 – one 10-bit A/D ch. at 5Gsps and one 10-bit D/A ch. at 5Gsps

UltraScale FPGAs are designed for applications that require massive I/O and memory bandwidth, huge data flow, and excellent DSP and packet-processing performance. The 20nm UltraScale architecture provides a number of advantages over Xilinx’s previous highest-end Kintex-7 and Virtex-7 28nm FPGA families, the largest of which are capable of holding the equivalent of up to 20 million ASIC gates. UltraScale offers a significant performance boost over this with the equivalent of 50 million ASIC gates, while reducing power consumption. The design also addresses the scalability limitations of system throughput and latency, and it improves communication, clocking, and critical paths to accommodate greater data flow. UltraScale also offers more and faster interconnects to minimize the bottleneck to silicon performance at advanced nodes. The increased number of routing resources improves handling of the large amount of data that current high-speed SerDes can deliver to these programmable devices.

Comparison of the Maximum Values of 20nm and 28nm Devices (Xilinx)

Comparison of the Maximum Values of 20nm and 28nm Devices (Xilinx)

The revamped clocking architecture on UltraScale chips uses a multi-region scheme reminiscent of ASIC designs. In this way, Xilinx greatly reduces the large portion of a clock period that is lost to skew. UltraScale devices additionally now support higher-resolution clock gating to enable ASIC-like power conservation. This results in higher-frequency operation, a reduction in timing problems caused by skew, lower power requirements, and higher overall bandwidth.

Working hand-in-hand with UltraScale devices is Xilinx’s Vivado Design Suite, an integrated design environment developed to support these newer, high-capacity FPGAs. Vivado is an IP and system-centric software tool that reduces the amount of time necessary to design programmable logic and I/O. It is a ground-up rewrite of their older design tool, ISE. 4DSP’s own StellarIP firmware design tool and proven reference design library supports both Vivado and ISE and can be used to automatically create compatible projects. StellarIP is part of the Board Support Package (BSP) included with all 4DSP FPGA-based boards and FMCs. The BSP also includes the 4FM GUI (multifunction test, monitoring and measurement tool) and the Data Analyzer (real-time digitized data and spectrum display tool).

4DSP is developing more new products that feature UltraScale processing, including a more advanced version of our popular CES720 (Compact Embedded System). These will be announced later this year, so keep an eye out here and in our press area for new developments.

14 Aug

The 4DSP CES720 is ideal for FMC Deployment

4DSP CES720

4DSP CES720

We are proud to highlight here in Austin the recent release of a new Compact Embedded System that is ideal for prototyping and development of high-speed data acquisition solutions. It is designed to serve as an embedded platform for deployment in UAVs or other applications with stringent size and weight requirements (SWaP-C). Known as the CES720, this small form factor, stand-alone system provides a complete and generic processing platform for data acquisition, signal processing, and communication.

The system is notable for both the performance it can deliver and its small size. Housed in an enclosure measuring about five inches square and three inches high, the highly portable CES720 weighs less than one kilogram. It features a low-power x86 CPU that is tightly coupled to a high-performance Xilinx Kintex-7 410T FPGA. This combination provides a flexible and powerful processing backbone for interfacing to the FMC site, CPU, and external DDR3 SDRAM, with plenty of room left over for Digital Signal Processing (DSP).

FMC inside CES720

FMC inside CES720

The flexibility of the CES720 allows users to customize the IO and DSP functionality of the system for a wide range of uses by choosing the FMC that best suits their needs. A removable panel on top of the enclosure allows easy access for installing an FMC chosen from 4DSP’s selection of 25 different modules. Alternatively, any one of a growing number of VITA 57.1-compatible cards from different vendors (more than 100, according to the VITA Standards Organization) can be installed in the CES720. The modularity of using FMCs with an FPGA carrier opens up opportunities to tailor a system for such applications as software-defined radio (SDR), beamforming, RADAR, and medical imaging among others.

Currently available as an air-cooled unit, the CES720 will also be released as a conduction-cooled Small Form Factor (SFF) solution later this year. Based on the emerging VITA 75 standard, the upcoming ruggedized version will be suitable for many applications where payload is limited. We will post more information about the new system here in the coming months.