16 Jun

4DSP Compact Embedded System Performance Boosted by UltraScale and SDAccel

4DSP CES820 Compact Embedded SystemWe recently announced two new additions to our innovative compact embedded system (CES) product line. The CES820 and ruggedized CESCC820 both benefit from powerful new Kintex UltraScale FPGAs supplied by longtime 4DSP partner Xilinx, and they offer support for the most recent version of Xilinx’s SDAccel development environment for OpenCL™, C, and C++. While the CES820 features the same durable aluminum enclosure as the CES720, which 4DSP introduced in 2014 to much enthusiasm from our customers, it represents a step forward in performance for the CES line.

The CESCC820 goes even further by providing a conduction-cooled and more vibration-resistant chassis, as well as military-grade Meritec connectivity options. The more spacious, yet still compact enclosure offers the choice to install more than one FPGA Mezzanine card (FMC) inside as a build option. These attributes make the ruggedized model an ideal choice for a wide range of deployed embedded aerospace and defense applications where Size, Weight, and Power (SWaP) are critical and more demanding IO or DSP requirements are called for.

4DSP CESCC820 Compact Embedded SystemBoth CES820 versions have a quad-core, low-power Intel Atom CPU that is tightly coupled to the FPGA, making them perfect for handling the high-level programmability necessary to perform anti-jamming, compression, encryption, high-performance signal processing for such applications as communication signal analysis. The full list of features, data sheets, block diagrams, and additional photos of these systems can be found on their respective product pages: CES820 and CESCC820.

FMC modules for these systems can be selected from 4DSP’s extensive and diverse portfolio or from a third-party vendor enabling extensive functional customization using VITA 57.1-compatible FPGA mezzanine cards. The 4DSP Board Support Package (BSP) and StellarIP firmware tool and library are included with these systems. These intuitive tools allow designers to jump into development with modular reference designs that exercise the systems’ capabilities and provide high-level interfaces and driver support.

 

Xilinx SDAccelXilinx Alliance Partner

 

 

 

These systems support the Xilinx SDAccel FPGA development environment. The newest version of SDAccel (2015.1) offers enhancements that make the Eclipse-based integrated development environment easier to use as a result of new debug and profiling features that speed the development and deployment of OpenCL, C, and C++ kernels. This release also builds on SDAccel’s Khronos standard compliance, supporting a new OpenCL Installable Client Driver (ICD). The ICD extension allows multiple implementations of OpenCL to co-exist on the same system, giving applications developers the ability to choose between CPUs, GPUs and FPGAs in real-time. This accelerates run time and results in power savings.

Looking ahead, as an SDAccel development environment-certified Xilinx Alliance Member, 4DSP’s future FPGA-based board and system-level products will also support SDAccel as part of our continuing effort to give system designers the very best tools for efficiently achieving great results.

14 Aug

The 4DSP CES720 is ideal for FMC Deployment

4DSP CES720

4DSP CES720

We are proud to highlight here in Austin the recent release of a new Compact Embedded System that is ideal for prototyping and development of high-speed data acquisition solutions. It is designed to serve as an embedded platform for deployment in UAVs or other applications with stringent size and weight requirements (SWaP-C). Known as the CES720, this small form factor, stand-alone system provides a complete and generic processing platform for data acquisition, signal processing, and communication.

The system is notable for both the performance it can deliver and its small size. Housed in an enclosure measuring about five inches square and three inches high, the highly portable CES720 weighs less than one kilogram. It features a low-power x86 CPU that is tightly coupled to a high-performance Xilinx Kintex-7 410T FPGA. This combination provides a flexible and powerful processing backbone for interfacing to the FMC site, CPU, and external DDR3 SDRAM, with plenty of room left over for Digital Signal Processing (DSP).

FMC inside CES720

FMC inside CES720

The flexibility of the CES720 allows users to customize the IO and DSP functionality of the system for a wide range of uses by choosing the FMC that best suits their needs. A removable panel on top of the enclosure allows easy access for installing an FMC chosen from 4DSP’s selection of 25 different modules. Alternatively, any one of a growing number of VITA 57.1-compatible cards from different vendors (more than 100, according to the VITA Standards Organization) can be installed in the CES720. The modularity of using FMCs with an FPGA carrier opens up opportunities to tailor a system for such applications as software-defined radio (SDR), beamforming, RADAR, and medical imaging among others.

Currently available as an air-cooled unit, the CES720 will also be released as a conduction-cooled Small Form Factor (SFF) solution later this year. Based on the emerging VITA 75 standard, the upcoming ruggedized version will be suitable for many applications where payload is limited. We will post more information about the new system here in the coming months.