CESCC820 - VITA 75
SWaP Embedded System
Ruggedized and Conduction Cooled

For an air-cooled version of this system please refer to the CES820

  • Description

      The CESCC820 (Compact Embedded System) is a ruggedized, small form factor embedded system designed to provide a complete and generic processing platform for data acquisition, signal processing, and communication. With Size, Weight, and Power (SWaP) in mind, the conduction-cooled CESCC820 features a low-power x86 CPU tightly coupled to a high-performance Kintex UltraScale UltraScale FPGA and FPGA Mezzanine Card (FMC - VITA 57.1). The UltraScale FPGA provides a flexible and powerful processing backbone for interfacing to the FMC sites, CPU, and DDR3 SDRAM, with plenty of room left over for high-performance Digital Signal Processing needs.


      The system is ideal as an embedded solution for demanding field deployment. FMCs can be chosen from 4DSP's extensive portfolio or from a third-party vendor. The compact but robust CESCC820 provides high-performance embedded processing and computing with flexible IO in a compact footprint for demanding applications where SWaP requirements and durability are the primary concerns.


      The CESCC820 can be ordered with Windows 7 or Debian Linux. Embedded operating system options are available. Contact sales@4dsp.com for more details.


      Download our white paper to learn more about 4DSP's FMC stacking technology.

  • System IO
      Meritec Hercules general purpose IO connections (VITA 75)
      HDMI
      USB
      1Gb Ethernet
      2x 10Gb Ethernet (optional)
      JTAG
      FMC HPC site (see the 4DSP FMC portal)
      PCIe communication between processor and FPGA
  • Processor - System controller
      Intel Atom Quad Core 1.91 GHz Processor
      2GB DDR3 SDRAM
      64GB SSD (2x 64GB SSD option)
      Windows and Linux support
  • FPGA
      Kintex UltraScale XCKU040
      4GB DDR3 SDRAM
      SDAccel support
  • Power
      DC 16V – 30V
      Optimized for battery/solar powered applications
  • Dimensions and Weight
      Enclosure base – 148mm x 163mm
      Enclosure body – 121mm x 163mm
      Height - 100mm
      Weight – 3.0 Kg
  • Board Support Package
      StellarIP is available for this product. It offers a simple way to design FPGA firmware with automated code and bitstream generation.
      Board control and monitoring tools
      Flash programming utility
      Confidence tests
      Host-side API
      Software program example
      Xilinx ISE projects
      Test firmware and VHDL source code
      Drivers for Windows and Linux
      Download the BSP datasheet for more information.
  • Environmental
      EnvironmentalConduction-cooled
      Operating Temperature0C to +55C-40C to +85C
      Storage Temperature-40C to +85C-55C to +105C
      Humidity95%95%
      Operating Vibration5Hz to 100Hz PSD increasing at 3 dB/ octave

      100Hz to 1000Hz PSD = 0.1 g^2/Hz

      1000Hz to 2000Hz PSD decreasing at 6 dB/octave
      5Hz to 100Hz PSD increasing at 3 dB/ octave

      100Hz to 1000Hz PSD = 0.1 g^2/Hz

      1000Hz to 2000Hz PSD decreasing at 6 dB/octave
      Operating Shock40g, 11 millisecond shock half-sine or 40g, 11 millisecond, terminal sawtooth shock pulses in all three axes40g, 11 millisecond shock half-sine or 40g, 11 millisecond, terminal sawtooth shock pulses in all three axes
      Operating Altitude-1500 ft to 60,000 ft-1500 ft to 60,000 ft
      Conformal CoatingOptionalOptional
  • Applications
      Beamforming
      Direction Finding
      Software Defined Radio (SDR)
      RADAR/SONAR Image Processor
      Satellite communication systems
      RADAR & Radio Jamming
      JPEG2000 Video Image Processors
      Baseband Communication Transceivers
      Multi-Channel digital receivers
      Up to 64M-point floating-point FFT processing
      Event Processor & Recorder